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2014-09-16 - Electrical Engineering 143 - 2014-09-16:Layout to Cross-Section, Design Rules.mp4
153.23MB
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785.09KB
2014-09-16 - Electrical Engineering 143 - 2014-09-16:Layout to Cross-Section, Design Rules.ogv
345.81MB
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193.4KB
2014-09-18 - Electrical Engineering 143 - 2014-09-18: Lithography I: Radiation Sources, Masks, Photoresist.mp4
147.85MB
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.____padding_file/1
152.67KB
2014-09-18 - Electrical Engineering 143 - 2014-09-18: Lithography I: Radiation Sources, Masks, Photoresist.ogv
340.86MB
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1.14MB
2014-09-23 - Electrical Engineering 143 - 2014-09-23: Lithography II: Optics, Resolution, Alignment Accuracy.mp4
169.77MB
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.____padding_file/2
235.98KB
2014-09-23 - Electrical Engineering 143 - 2014-09-23: Lithography II: Optics, Resolution, Alignment Accuracy.ogv
351.76MB
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246.83KB
2014-09-25 - Electrical Engineering 143 - 2014-09-25: Oxidation I: Thermal Oxidation Models, Deposition Methods.mp4
155.71MB
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.____padding_file/3
300.57KB
2014-09-25 - Electrical Engineering 143 - 2014-09-25: Oxidation I: Thermal Oxidation Models, Deposition Methods.ogv
354.73MB
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1.27MB
2014-09-30 - Electrical Engineering 143 - 2014-09-30: Oxidation II: Graphs, Dopant Redistribution, Device Isolation.mp4
148.36MB
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.____padding_file/4
1.64MB
2014-09-30 - Electrical Engineering 143 - 2014-09-30: Oxidation II: Graphs, Dopant Redistribution, Device Isolation.ogv
354.26MB
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1.74MB
2014-10-02 - Electrical Engineering 143 - 2014-10-02: Physical Film Deposition: Evaporation, Sputtering.mp4
158.45MB
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.____padding_file/5
1.55MB
2014-10-02 - Electrical Engineering 143 - 2014-10-02: Physical Film Deposition: Evaporation, Sputtering.ogv
347.66MB
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351KB
2014-10-07 - Electrical Engineering 143 - 2014-10-07: Chemical Film Deposition -- LPCVD, PECVD, ALD, Epitaxy.mp4
158.96MB
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.____padding_file/6
1.04MB
2014-10-07 - Electrical Engineering 143 - 2014-10-07: Chemical Film Deposition -- LPCVD, PECVD, ALD, Epitaxy.ogv
356.55MB
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1.45MB
2014-10-09 - Electrical Engineering 143 - 2014-10-09: Etching I -- Anisotropy, Selectivity, Wet Etching.mp4
143.13MB
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.____padding_file/7
894.72KB
2014-10-09 - Electrical Engineering 143 - 2014-10-09: Etching I -- Anisotropy, Selectivity, Wet Etching.ogv
349.85MB
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153.3KB
2014-10-14 - Electrical Engineering 143 - 2014-10-14: Ion Implantation I -- Etching II: Plasma Etching, Reactive Ion Etching.mp4
146.24MB
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.____padding_file/8
1.76MB
2014-10-14 - Electrical Engineering 143 - 2014-10-14: Ion Implantation I -- Etching II: Plasma Etching, Reactive Ion Etching.ogv
345.71MB
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297.3KB
2014-10-16 - Electrical Engineering 143 - 2014-10-16: Ion Implantation I -- Range & Straggle, Lateral Straggle, Jcn. Depth.mp4
154.6MB
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2014-10-16 - Electrical Engineering 143 - 2014-10-16: Ion Implantation I -- Range & Straggle, Lateral Straggle, Jcn. Depth.ogv
337.7MB
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305.18KB
2014-10-21 - Electrical Engineering 143 - 2014-10-21: Ion Implantation II -- I%2fI Through Layers, Tables.mp4
147.14MB
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.____padding_file/10
878.91KB
2014-10-21 - Electrical Engineering 143 - 2014-10-21: Ion Implantation II -- I%2fI Through Layers, Tables.ogv
349.04MB
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985.51KB
2014-10-23 - Electrical Engineering 143 - 2014-10-23: Diffusion I -- Predeposition, Drive-In, Modeling.mp4
151.87MB
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133.57KB
2014-10-23 - Electrical Engineering 143 - 2014-10-23: Diffusion I -- Predeposition, Drive-In, Modeling.ogv
335.09MB
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933.07KB
2014-10-28 - Electrical Engineering 143 - 2014-10-28: Diffusion II: 2-Step Diffusion, Successive Diffusions, Lateral Diffusion.mp4
152.3MB
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1.7MB
2014-10-28 - Electrical Engineering 143 - 2014-10-28: Diffusion II: 2-Step Diffusion, Successive Diffusions, Lateral Diffusion.ogv
340.96MB
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1.04MB
2014-11-04 - Electrical Engineering 143 - 2014-11-04: Diffusion III: Series Resistance, Irvin’s Curves, Concentration Dep..mp4
149.96MB
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40.11KB
2014-11-04 - Electrical Engineering 143 - 2014-11-04: Diffusion III: Series Resistance, Irvin’s Curves, Concentration Dep..ogv
307.42MB
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598.76KB
2014-11-06 - Electrical Engineering 143 - 2014-11-06: Interconnects: Contacts, Metallization, Silicides, Damascene Proc..mp4
155.51MB
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505.75KB
2014-11-06 - Electrical Engineering 143 - 2014-11-06: Interconnects: Contacts, Metallization, Silicides, Damascene Proc..ogv
338.37MB
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1.63MB
2014-11-13 - Electrical Engineering 143 - 2014-11-13: Metal MEMS, Adv. CMOS I: Device Structure, Process Flow.mp4
137.23MB
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784.03KB
2014-11-13 - Electrical Engineering 143 - 2014-11-13: Metal MEMS, Adv. CMOS I: Device Structure, Process Flow.ogv
322.43MB
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1.57MB
2014-11-18 - Electrical Engineering 143 - 2014-11-18: Adv. CMOS II: Process Flow (cont.), Punchthrough.mp4
153.16MB
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864.67KB
2014-11-18 - Electrical Engineering 143 - 2014-11-18: Adv. CMOS II: Process Flow (cont.), Punchthrough.ogv
340.4MB
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1.6MB
2014-11-20 - Electrical Engineering 143 - 2014-11-20: Adv. Isolation: Problems w%2f LOCOS, Trench Isolation.mp4
152.5MB
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1.5MB
2014-11-20 - Electrical Engineering 143 - 2014-11-20: Adv. Isolation: Problems w%2f LOCOS, Trench Isolation.ogv
336.09MB
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1.91MB
2014-11-25 - Electrical Engineering 143 - 2014-11-25: Device Characterization I: MOS-CV Curve --> xox, Na, VFB.mp4
164.6MB
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1.4MB
2014-11-25 - Electrical Engineering 143 - 2014-11-25: Device Characterization I: MOS-CV Curve --> xox, Na, VFB.ogv
346.06MB
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1.94MB
2014-12-02 - Electrical Engineering 143 - 2014-12-02: Vt Implant: Threshold Voltage, Shallow vs. Deep Vt Implant.mp4
171.86MB
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143.76KB
2014-12-02 - Electrical Engineering 143 - 2014-12-02: Vt Implant: Threshold Voltage, Shallow vs. Deep Vt Implant.ogv
347.22MB
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797.63KB
2014-12-04 - Electrical Engineering 143 - 2014-12-04: Device Characterization II: MOS Device Models, MOS IV Curve --> L, W, mobility, Body effect; Latch-Up, Course Wrap Up.mp4
152.01MB
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1.99MB
2014-12-04 - Electrical Engineering 143 - 2014-12-04: Device Characterization II: MOS Device Models, MOS IV Curve --> L, W, mobility, Body effect; Latch-Up, Course Wrap Up.ogv
277.69MB
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321.83KB
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1.98MB
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1.96MB
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1.96MB
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1.98MB
ucberkeley_webcast_itunesu_919223589_meta.sqlite
91KB
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1.91MB
ucberkeley_webcast_itunesu_919223589_meta.xml
2.1KB
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